(Auszug aus der Pressemitteilung)
Taipei, Aug. 1st, 2006 – SiS today announced the great success of its unprecedented innovation of the CDFN packaging for the DRAM modules, which is different from the traditional TSOP and BGA packaging.
The idea of the advanced CSP (Chip Scale Package) comes from the characteristics of personalization and portability of electronic devices. The size of packaged IC with the CSP becomes much smaller than it used to be, which means it is almost the same size as die. The length of packaged IC will not be longer than 1.2 times of the length of die, and the measurement of packaged IC will not be bigger than 1.4 times of the measurement of die. SiS’s CDFN (Chip Scale Dual Fine-pitch No-lead) packaging technology integrates the strength of the CSP to differentiate itself from traditional packaging, which leads SiS to a whole new world of involving in DRAM modules with a huge potential market.
The CDFN package not only reduces the ratio of measurement of IC to packaging size, which extensively shortens the time of data transmission but also fulfills the need of consistently increasing the I/O pin counts. Most important of all, it has met RoHS compliance. “SiS determined to apply the CDFN packaging in developing DDR and DDR2 modules after considering the uniqueness of this technology. We are confident of its capabilities of high speed, low power-consumption, low cost, and high capacity, which enables SiS to differentiate the market.”, said Daniel Chen, CEO and President of SiS.
The CDFN package is suitable for use in IC with low I/O pin count, such as those ICs in DRAM modules and in portable devices. It is easy to foresee the potential profit the CDFN brings coming with the development of IA, DTV, E-Book, WLAN/Gigabit Ethernet, ADSL, Bluetooth, and etc.