A-DATA Presenting it Latest XPG DRAM Modules with Superior Thermal Conductive Technology at Computex 2009

(Auszug aus der Pressemitteilung)

Taipei, Taiwan – May 25, 2009 – A-DATA Technology Co., Ltd., a worldwide leading manufacturer in high-performance DRAM modules and Flash application products, presenting its entire XPG™ – Xtreme Performance Gear product line and latest XPG Series DRAM modules with superior conductive technology in Nangang Exhibition Hall during Computex Taipei 2009.


As the success of presenting the leading XPG Xtreme series DDR3-2133X v2.0 DRAM module in the industry at CeBIT 2009, A-DATA presenting its XPG Plus Series v2.0 and Gaming Series v2.0 DRAM module with superior thermal conductive technology and characteristics heat sink design at Computex 2009.

Adopting new dual cooper heat pipe design, the XPG Plus Series v2.0 DRAM module offers offload heat with extreme efficiency to ensure superior stability and performance. Each memory chip is direct contact with a thermo-conductive copper heat pipe to perform heat away from the memory components, and dissipates it through the aluminum fin array. The XPG Gaming Series v2.0 DRAM module adopts additional surface area of heat sink to provide effective heat dissipation via effective heat sink design.

Moreover, both XPG Plus Series v2.0 and XPG Gaming Series v2.0 DRAM module come with doubling amount of copper of PCB (printed circuit board) to delivering low temperature and better power efficiency from critical areas of the DRAM module.

A-DATA is also presenting its new XPG SX94 2.5” SATA II SSD with RAID 0 array, available in 256GB and 512GB capacity, to deliver up to 230MB/sec and 160MB/sec read/write killer speed and reliability.