CellShock starts shipping new ultra-perfomance DDR3 memories

(Auszug aus der Pressemitteilung)

Stutensee, 15.Aug. 2007 – MSC – german manufacturer of high end electronics and memory modules – today launches their DDR3-lineup under the CellShock brand which will be available immediately.

• CS3222580 DDR3 1800Mhz 8-7-6-21 2GB Dual Channel Kit
• CS3222270 DDR3 1600Mhz 7-6-6-18 2GB Dual Channel Kit

Based on the much sought after Micron DDR3 ICs and binned to aggressive 7-6-6-18 (1600) and 8-7-6-21 (1800) timings both products represent the lowest latency 1600 and 1800 Kits available on the market. This was possible due to Cellshocks advanced binning process and an ultra low noise PCB optimized for Micron DDR3 ICs.

The new DDR3-products from CellShock are designed for performance-hungry enthusiasts eager to upgrade to the latest memory technology and aiming for maximum performance in games, demanding applications and benchmarks.

Specification of the new CellShock DDR3-products :

• Part #:
  CS3222270

• Capacity:
  2GB-Kit (2x1GB)

• Config:
  128Mx64

• DRAM:
  Micron

• Device Config:
  128Mx8

• PCB:
  240pin

• Module Info:
  unbuffered, Non-ECC, DDR3 DIMM

• Speed:
  PC12800

• Cas Latency:
  7-6-6-18

• VDIMM :
  1,7V – 1,9V

• Warranty:
  5 years

• Part #:
  CS3222580

• Capacity:
  2GB-Kit (2x1GB)

• Config:
  128Mx8

• DRAM:
  Micron

• Device Config:
  128Mx8

• PCB:
  240pin

• Module Info:
  unbuffered, Non-ECC, DDR3 DIMM

• Speed:
  PC14400

• Cas Latency:
  8-7-6-21

• VDIMM :
  1,7V – 1,9V

• Warranty:
  5 years

CS3222270 (SRP € 439 incl. tax) and CS3222580 (SRP € 499 incl. tax) are available now.