A-DATA X Series version 2.0

(Auszug aus der Pressemitteilung)

A-DATA proudly introduces the latest cooling solution for extreme performance X Series memory modules. A-DATA’s X Series version 2.0 includes 4 types of cooling solutions* – active cooling, passive cooling, water cooling, and liquid cooling. You don’t have to remove heat spreaders and buy an after market ram module cooling solution, you have them all here! With new X Series version 2.0 high performance modules, you have total control of your high performance memory modules by selecting your favorite cooling solution.

This product clocks at DDR3-1600 CL7-7-7-20 by 1.75V~1.85V and is available as 1GB x 2 and 2GB x 2 dual-channel kits. In addition, X Series version 2.0 heat spreader comes with 2.4W/mK high performance heat conductive thermal pad which has twice of thermal conductivity performance than any others (1.2 W/mK).

OC team is a newly formed independent unit within the big A-DATA family with the objective to develop high-end performance products. Please visit http://www.adata.com.tw/OCforum to see how OC team utilizes X Series version 2.0 in both, high performance mode and power saving mode.
A-DATA X Series memory represents the ultimate overclocking performance. It was developed to unleash the hidden power of CPU and motherboard by using A-DATA’s latest overclocking IC sorting technology.

* XPG cooling solution can only be installed on X Series version 2.0 heat spreaders.

Product release date:
Active cooling 1-Oct-2008
Passive cooling by demand
Water cooling by demand
Liquid cooling by demand