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Elitegroup Computer Systems (ECS), a global leader in motherboards, mini PCs, and embedded computing platforms, announced its participation in Embedded World 2026, taking place in Nuremberg, Germany, from March 10 to 12, 2026. ECS will exhibit at Hall 1, Booth 1-540, showcasing its latest LIVA mini PC platforms and embedded motherboard solutions focused on fanless system design, edge computing performance, and scalable industrial deployment.
At Embedded World 2026, ECS will present three major product themes, including next-generation fanless mini PCs, edge computing mini PCs for performance-driven workloads, and a new Thin Mini-ITX embedded motherboard platform. The lineup is designed to address growing demand for reliable, low-power, and highly integrated computing platforms across industrial automation, smart retail, transportation, and embedded applications.
Expanding Fanless Computing for Embedded and Industrial Applications
The new LIVA Z4F is designed for low-power embedded deployments, powered by Intel® Core™ 3 Processor N350 or Intel® Processor N250 / N150. The system supports DDR5 4800 memory up to 16GB, features dual Gigabit LAN, and offers HDMI and USB Type-C Alt. DisplayPort for multi-display output, making it suitable for kiosks, industrial controllers, and edge gateway applications.
The Z5F PLUS targets performance-oriented fanless applications, supporting 13th and 14th Gen Intel® Core™ U-series processors (15W) with up to 64GB DDR4 memory. It provides four display outputs, 2.5GbE LAN, and multiple COM ports, and supports wall mount and DIN rail installation, making it suitable for multi-display signage, industrial control, and system integration projects.
The M600 focuses on connectivity and industrial I/O expansion, supporting Intel® Core™ i3-N305, Intel® Processor N200, and Intel Atom® x7211E / x7425E processors. It features dual 2.5GbE LAN, multiple COM ports, and WWAN module support for mobile connectivity, with a fanless design for transportation, remote monitoring, and industrial IoT deployments.
Scaling Edge Computing Performance for AI and Data-Driven Applications
The LIVA Z11 PLUS is powered by Intel® Core™ Ultra 7 255H / 225H and Ultra 7 155H / Ultra 5 125H processors, supporting dual DDR5 memory up to 96GB and dual PCIe Gen4x4 NVMe SSDs for high-speed storage. The system features dual network interfaces (2.5GbE + Gigabit LAN) and supports two HDMI outputs with CEC and two USB Type-C Alt. DisplayPort for multi-display configurations. In addition, Z11 PLUS is equipped with two 40G USB4 Type-C connections, enabling high-bandwidth data transfer and device expansion for edge AI inference and data-intensive applications.
The LIVA P500 H610 targets performance-oriented edge workloads, supporting 12th, 13th, and 14th Gen Intel® Core™ processors (up to 65W) on the Intel® H610 chipset platform with DDR5 memory up to 128GB. The system provides PCIe Gen5 x16 expansion for discrete graphics cards and multiple storage options including PCIe NVMe and 2.5” SATA. With dual LAN (2.5GbE + Gigabit) and support for WWAN modules for mobile connectivity, P500 H610 is suitable for edge AI, machine vision, and mobile or distributed embedded systems.
Strengthening Embedded Platform Design with the H810H8-TI Thin Mini-ITX Motherboard
ECS will also showcase the H810H8-TI Thin Mini-ITX motherboard, based on the Intel® H810 chipset and supporting Intel® Core™ Ultra processors for the LGA 1851 socket (up to 65W TDP). The board supports dual-channel DDR5 6400MHz memory up to 96GB and integrates PCIe Gen5 x4 M.2 2280 for high-speed NVMe SSDs, along with M.2 2230 Key E for wireless expansion. For system integration, H810H8-TI provides two HDMI outputs, 2.5GbE LAN, and two SATA 6Gb/s ports, together with a comprehensive set of onboard headers including COM, LVDS, SATA power, front panel, and audio. Measuring 170 x 170 mm and supporting Windows 11 and Linux, the board is designed for embedded systems, digital signage players, and compact industrial PC platforms.






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