XERON Showcases Complete PC Hardware Ecosystem at Gamescom 2026, Expands into the European Market

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XERON, a new PC hardware brand guided by its „From Origin, Beyond Boundaries“ philosophy of returning to first principles through purposeful design and user-focused innovation, will exhibit at Gamescom 2026 from August 26 to 30 at Koelnmesse, Cologne, Germany. Following its successful global debut at COMPUTEX 2026, Gamescom marks XERON’s first major exhibition in Europe as the company expands its presence into the European market.

At Gamescom 2026, XERON will showcase its complete ecosystem of PC hardware products, including PC cases, power supplies, cooling solutions, thermal interface materials, and accessories. The exhibition also serves as an opportunity for the company to establish new partnerships across Europe, with XERON actively seeking distributors and channel partners interested in bringing the brand’s products to regional markets.

Visit XERON at Gamescom 2026
Date: August 26–30, 2026
Venue: Koelnmesse, Cologne, Germany
Hall: 03.2
Booth: F-049g

Seeking European Distribution Partners

As part of its European expansion strategy, XERON is actively seeking distributors, retailers, and strategic channel partners across Europe. The company welcomes opportunities to collaborate with partners interested in introducing XERON’s growing portfolio of PC hardware products to local markets.

Visitors, media representatives, and potential business partners are invited to meet the XERON team during Gamescom 2026 to experience its latest products and discuss future cooperation opportunities.

Featured Products

C-LAB Flagship Enthusiast Chassis

Leading the showcase is the C-LAB, XERON’s flagship art gallery PC case that embodies the company’s design philosophy of combining performance with modern industrial aesthetics. Designed as a premium showcase chassis, the C-LAB demonstrates XERON’s vision of transforming the personal computer into both a high-performance system and a design centerpiece.

XERON T1000 Flagship AIO Cooler with Cu-Diamond Cold Plates and Liquid Metal Cooling

The T1000 is XERON’s flagship all-in-one liquid cooler with next-generation cooling technology designed to meet the demands of increasingly powerful processors. This liquid cooler combines two innovative technologies — a diamond-copper composite cold plate and dual liquid loop cooling — to improve heat transfer and maintain more consistent CPU temperatures under demanding workloads.

Diamond-Copper Composite Cold Plate

Replacing the conventional solid copper cold plate used in most AIO liquid coolers, the T1000 features a diamond-copper composite cold plate that delivers approximately 1.5 to 2.5 times the thermal conductivity of copper. This enables faster heat transfer away from the CPU, reducing thermal resistance and lowering CPU temperatures by around 5°C under comparable conditions.

Independent Dual Loop Cooling

The XERON T1000 features an innovative independent dual-loop cooling system that combines a sealed liquid metal loop with a conventional coolant loop. Unlike traditional AIO liquid coolers that rely solely on coolant, the T1000 uses liquid metal to rapidly absorb heat directly from the CPU before transferring it through a copper interface to the primary liquid cooling loop.

By spreading concentrated heat across a larger surface area before it reaches the coolant, the dual-loop design improves heat transfer efficiency and enables the radiator to dissipate heat more effectively. This helps reduce temperature spikes during sudden CPU load changes while minimizing fan ramp-up and operating noise.

Power Supplies

LUX PT Series

The LUX PT Series is a lineup of fully modular ATX 3.1 power supplies available in 750W, 850W, 1000W, and 1200W capacities. Certified with 80 PLUS Titanium and PPLP Titanium, the series features full Japanese capacitors, pure copper cables, and a bridge-less APFC circuit with LLC and D2D architecture for exceptional efficiency and long-term reliability.

LUX PT WS Series

Designed for AI workstations and professional systems, the LUX PT WS Series includes 1650W and 2500W models both with multiple 12V-2×6 connectors to support multi-GPU configurations. The series combines Titanium-level efficiency with premium components to deliver stable power for high-performance computing applications.

MAX PG Series

Available in 650W, 750W, and 850W models, the MAX PG Series features 80 PLUS Gold, Cybenetics Gold, and PPLP Gold certifications. Built with full Japanese capacitors, pure copper cables, and bridge-less APFC with Dual Forward and D2D architecture, the series delivers efficient and reliable power in a compact 140mm housing.

MAX PB Series

The MAX PB Series offers mainstream ATX 3.1 power supplies from 550W to 850W with 80 PLUS 230V EU Bronze certification. Featuring full Japanese capacitors and DC-to-DC architecture, the series provides dependable performance for gaming and productivity systems.

MAX PS Series

Designed for compact systems, the MAX PS Series consists of fully modular SFX12V 4.1 & ATX12V 3.1 power supplies available in 650W, 750W, 850W, and 1000W capacities. Certified with 80 PLUS Gold and PPLP Gold, the series is ideal for high-performance small form factor PCs.

MAX PX Series

The MAX PX Series expands XERON’s SFX lineup with 80 PLUS Platinum certified models in 750W, 850W, and 1000W capacities. Featuring premium components and high-efficiency architecture, the series targets enthusiast-grade compact systems.

MAX P3000G WS

The MAX P3000G WS 3000W 80 PLUS Gold power supply is also designed for AI servers and multi-GPU workstations. It supports the latest high-power hardware through multiple 12V-2×6 connectors and an advanced APFC, Full-Bridge LLC, and D2D architecture.

Cooling Solutions

LUX L360 VISION

The LUX L360 VISION all-in-one liquid cooler features a 6.67-inch curved OLED display protected by AG glass with an Infinity Mirror Expansion panel that extends vision beyond the bounds of the screen. It is paired with a low-noise pump and 2400RPM dual-curve fans to deliver cooling performance of up to 320W TDP. For improved cooling, the LUX L360 VISION uses an offset bracket that aligns the CPU hotspot with the center of the copper coldplate reducing CPU temperature by 2~3°C compared to standard brackets.

NEX L360 ARGB

The NEX L360 ARGB Series combines simplified installation and daisy-chain fan wiring for a clutter-free build. It comes equipped with a silent pump, Magnetic 3D Lightning Ornament, and annular ARGB fans provide efficient cooling with vibrant lighting effects. The NEX L360 ARGB liquid cooler also features an offset bracket that aligns the CPU hotspot with the center of the copper coldplate reducing CPU temperature by 2~3°C compared to standard brackets.

MAX F120 Series

The MAX F120 Series cooling fans utilize dual-curve blades and turbulence-reduction optimizations to improve airflow efficiency while maintaining low noise levels. A one-cable design simplifies cable management.

NEX F120A / NEX F120RA Series

Available in forward and reverse blade configurations, the NEX F120A and NEX F120RA ARGB fans feature integrated fan blades and side hollow cutouts to maximize airflow while showcasing vivid lighting effects.

Thermal Interface Materials

LUX E71 Liquid Metal Thermal Paste

A high-performance liquid metal thermal interface with thermal conductivity rated at 26W/m·K, designed for enthusiast systems requiring maximum heat transfer.

MAX E72 Liquid Metal Composite Thermal Grease

The MAX E72 is a liquid metal composite thermal paste designed to combine the high thermal performance of liquid metal with the ease of use and safety of conventional thermal paste. Its embedded liquid metal microstructure prevents shifting and leakage while ensuring consistent contact between the CPU and cooler. With effective thermal conductivity exceeding 8 W/m·K and low thermal resistance, the MAX E72 delivers efficient heat transfer, improved long-term stability, and easier application than pure liquid metal.

NEX E75 & NEX E72 Thermal Grease

The NEX E72 and NEX E75 thermal pastes feature the same electrically insulated formula, available in 2g and 5g capacities. Designed for mainstream PCs, laptops, and graphics cards, the soft, easy-to-apply compound forms an ultra-thin interface layer to reduce thermal resistance and improve heat transfer between the processor and cooler. Optimized for everyday cooling and maintenance, the NEX Series delivers reliable long-term thermal performance with simple application.

See pricing of featured products below: