SAPPHIRE Technology Unveils EDGE+ Apex Robotics Platform for Next-Generation Physical AI

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SAPPHIRE Technology today unveiled the EDGE+ Apex SOM/Carrier Robotics Platform, a production-ready hardware platform powered by AMD Ryzen™ AI Embedded X100 Series processors and designed to accelerate the development and deployment of physical AI in autonomous robotics. The platform has been showcased at AMD Advancing AI 2026 in San Francisco.

Built for rugged, always-on robotics deployments, the EDGE+ Apex platform pairs a COM-HPC module based on AMD Ryzen™ AI Embedded X100 Series processors with up to 128GB of LPDDR5x memory and SAPPHIRE’s purpose-built robotics carrier board to deliver the perception, planning and control performance autonomous machines require at the edge.

„Physical AI is reshaping how machines perceive, decide and act in the real world,“ said Sumit Shah, head of product management and marketing, Adaptive and Embedded Computing Group, AMD. „AMD Ryzen™ AI Embedded X100 Series processors deliver a scalable, open x86 platform that unifies AI, real-time control and industrial reliability to enable the next generation of autonomous systems without locking developers into a single compute architecture software stack.“

Powered by AMD Ryzen™ AI Embedded X100 Series processors, EDGE+ Apex combines CPU, GPU and NPU acceleration to support real-time perception, complex scene understanding and autonomous decision-making. Designed for continuous industrial operation, the platform also benefits from deterministic real-time performance, unified memory architecture, and long-term lifecycle availability for demanding edge AI deployments.

The EDGE+ Apex platform is designed to give robotics developers an open, developer-friendly foundation. EDGE+ Apex supports an open software ecosystem that allows developers to work with familiar AI frameworks while taking advantage of AMD ROCm™ and Ryzen™ AI software across CPU, GPU and NPU compute engines, helping accelerate development and simplify deployment.

„With EDGE+ Apex, our goal was to hand robotics builders a complete, production-ready foundation so they can focus on their application, not their hardware,“ said Paul Smith, Senior Director, SAPPHIRE Embedded Solutions. „By building on AMD Ryzen™ AI Embedded X100 Series processors and combining them with a robotics carrier board engineered for real-world sensing, connectivity and control, EDGE+ Apex helps customers move from prototype to production faster while scaling physical AI across the most demanding always-on environments.“

Purpose-Built for Real-World Robotics

The EDGE+ Apex platform is offered as a modular SOM and carrier design engineered for autonomous machines. The COM-HPC System-on-Module is built around AMD Ryzen™ AI Embedded X100 Series processors with up to 128GB of LPDDR5x memory, a Functional Safety (FuSa)-capable power design and Trusted Platform Module 2.0 compliance for safety-critical and secure deployments.

The companion EDGE+ Apex robotics carrier board uses AMD UltraScale+ FPGA to provide an extensive robotics I/O set, including GMSL camera interfaces with power, CAN-FD, EtherCAT/TSN networking, multi-gigabit Ethernet QSFP, USB4 Type-C, OCuLink PCIe Gen5 expansion and an onboard IMU. Together, these interfaces provide developers with everything needed to connect sensors, actuators and industrial networks in a single integrated platform.

The EDGE+ Apex platform will be available in two components: an AMD Ryzen™ AI Embedded X100 Series processor COM-HPC Client B SOM and a AMD UltraScale+ FGPA robotics targeted carrier board.

Expanding SAPPHIRE’s Physical AI Portfolio with AMD Kria™ AI platform

EDGE+ Apex is part of SAPPHIRE’s expanding EDGE+ portfolio built on AMD adaptive computing technologies, including the AMD Kria™ AI platform for production-ready System-on-Module designs. Together, these platforms provide scalable hardware and open software solutions for robotics, machine vision, industrial automation and physical AI applications, helping customers accelerate development while reducing engineering effort and time to market.