(Auszug aus der Pressemitteilung)
SARATOGA, CA – MAY 18, 2009 – Futuremark® Corporation today announced a
game, DIY, and overclocking enthusiasts from Europe, Asia and the
Americas competing for the „Lord of Overclocking“ title for their
region. With Futuremark anticipating over 200,000 entries, the online contest will be the largest overclocking competition ever staged.
The contest will run from May 18th to June 14th with prizes on offer
for the top weekly, random, and overall winners in each region.
Furthermore, one overall top winner will also be invited to attend the
MSI Master Overclocking Arena 2009 event in Beijing, China in September
Grand Prize includes: MSI P45 Diamond motherboard and N260GTX VGA card,
Huntkey X7 900W power supply, Thermaltake Element S pro case,
GlacialTech XWing NB Cooling Pad, Enermax Apollo (8cm+12cm) cooling
Weekly prizes include: MSI X58 Pro-E motherboard and N250GTS VGA card,
Huntkey X7 800W power supply, Thermaltake V9 gaming case, GlacialTech
UFO CPU Cooler, Enermax Cluster, Everest, Magma (8cm+12cm) cooling
Weekly random prizes: Patriot Memory 3GB 1600Mhz Viper Tri-Channel
„Overclocking is growing in popularity all the time and on average we
see a new benchmark result submitted to our database every 4 seconds.
This worldwide competition gives people in three regions the chance to
compete for great prizes. We will be surprised if records are not
broken,“ said Jukka Mäkinen, Futuremark’s Vice President, Products and
„This is the largest overclocking event of its type we’ve ever seen.
We’re delighted to be supporting overclockers everywhere with this
community building competition,“ said Jason Lee, MSI’s Marketing
Contestants will be competing to see who can achieve the highest score
with 3DMark06, a benchmark program from Futuremark that measures the 3D
gaming performance capabilities of PCs. 3DMark software has been
downloaded more than 45 million times. The 3DMark06 edition is
currently the world’s most popular benchmark and can be downloaded for
free from the Futuremark website.