Samsung First to Begin Shipping 40nm-class, 32-Gigabyte Memory Module for Server Applications

(Auszug aus der Pressemitteilung)

SEOUL, Korea – March 29, 2010 – Samsung Electronics Co., Ltd., the world

leader in advanced memory technology, announced today that it has begun
shipping samples of the industry’s highest-density memory module for server
systems. The 32 gigabyte (GB) module has been designed for use in advanced
servers, which require high-density and high-performance features at
low-power consumption levels.

According to Soo-In Cho, president and general manager of Samsung
Electronics Memory Division, “Samsung continues to set the pace in advanced
memory for high-end server applications by offering 40nm-class 32GB memory
modules to reach previously unattainable levels of system capacity. In just
10 months, Samsung has now secured the best competitive advantage with the
broadest portfolio of 40nm-class DDR3 based memory solutions in the
industry since the 40nm-class DRAM was first produced last July.”

“Technology leadership is a key factor in Samsung’s aggressive
competitiveness within the memory industry,” Mr. Cho emphasized, “Our
highly successful implementation of 40nm-class technology is indicative of
our determination to move toward the 30nm-class process node in the second
half of this year. Our 30nm-class technology will provide even more
advanced memory solutions for high-end server and PC applications.”

Samsung is using the industries highest-density monolithic DDR3 device – a
40-nanometer (nm) class, four gigabit (Gb) DDR3 chip – as the building
block for the new 32GB module. This comes just one year after the company
announced its 50nm-class 2Gb based, 16GB registered dual inline memory
module (RDIMM) last March.

The highly-efficient 32GB RDIMM consists of 36 dual-die 40nm-class 4Gb DDR3
chips that can perform at equal or greater levels to a 40nm-based 16GB
RDIMM with no increase in power consumption.

By equipping a dual CPU, two-way server with 32GB modules, a server system
can have up to 384GB of memory. This allows for doubling the previously
largest density of 192GBs per server with a power increase of less than
five percent over that needed for a 16GB module-based system.

In addition, replacing 12 DRAM modules of 16GB density with just six 32GB
modules would achieve a 192GB total density, while allowing the DRAM
operating speed in a two-way server system to rise by 33 percent from 800
megabit per second (Mbps) to 1,066Mbps, as power is cut by 40 percent.

In high-performance, four-way servers using 16GB modules, one terabyte of
DRAM would be commonplace. By using 32GB RDIMMs, Samsung is moving toward
providing four-way servers with 2TB of DRAM each, a migration that it
believes will spur introduction of diverse software and a broader scale of
server applications. Mass production of the 32GB RDIMM is slated to begin
next month.