Samsung Ships Industry’s First Multi-chip Package with a PRAM Chip for Handsets
SEOUL, Korea, April 28, 2010 – Samsung Electronics Co., Ltd., the world leader in advanced semiconductor technology solutions, today announced the industry’s first multi-chip package (MCP) with PRAM – for use in...
Neueste Kommentare
1. November 2026
21. Oktober 2026
21. Oktober 2026
18. Oktober 2026
18. Oktober 2026
18. Oktober 2026