Verschlagwortet: VIA Technologies

VIA stellt neues VIA Edge AI Developer Kit vor

Beschleunigt die Markteinführung von Smart-Kamera-, Signage-, Kiosk- und Robotik-Systemen, die für Video-KI-Anwendungen optimiert sind

Taipeh (Taiwan), 14. Mai 2018 – VIA Technologies, Inc., einer der führenden Anbieter energieeffizienter ARM- und x86-basierter IT- und Embedded Plattformen, gibt die Markteinführung seines neuen VIA Edge AI Developer Kits für...

15.05.2018

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VIA Announces Ultra Compact, Fanless VIA AMOS-3002 System

Delivers power efficient dual core processing in a ruggedized chassis system for a diversified range of embedded applications

Taipei, Taiwan, 17th May, 2012 – VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA AMOS-3002, an ultra compact, fanless system designed around the tiny VIA...

17.05.2012

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VIA Announces World’s First Quad Core Mini-ITX Boards

Most power efficient x86 quad core solution available on the market, targeted for immersive HD embedded environments

Taipei, Taiwan, 23rd February, 2012 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the world’s first quad core Mini-ITX boards featuring the latest VIA QuadCore...

23.02.2012

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VIA Announces Highest Performance Dual Core VIA EPIA-M910 Mini-ITX Board

The VIA EPIA-M910 is the ideal solution for a wide range of embedded applications featuring one of the richest I/O sets available for the embedded market

Taipei, Taiwan, 9th February, 2012 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-M910 Mini-ITX board, the latest dual core Mini-ITX board featuring...

09.02.2012

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VIA Launches First Ever Dual Core Pico-ITX Mainboard

The VIA EPIA-P900 packs in dual-processing capabilities into the industry’s smallest commercialized motherboard form factor

Taipei, Taiwan, November 9th, 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the industry’s first Pico-ITX board with dual core processing. Measuring just 10cm...

09.11.2011

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VIA Brings Fanless Dual Core Computing and USB 3.0 to Thin Embedded Devices

The new VIA EITX-3002 slim-line Em-ITX form factor board offers rich I/O and multimedia capabilities in a rugged VIA AMOS-5002 Industrial Chassis Kit

Taipei, Taiwan, 2 November 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest Em-ITX form factor board, the VIA EITX-3002, which combines rich...

02.11.2011

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