VIA Introduces VIA AMOS-5001 Chassis Kit for Slim Em-ITX Embedded Systems
Robust, flexible, and fanless, the VIA AMOS-5001 modular chassis kit provides the world’s slimmest and most compact chassis design for a broad spectrum of x86 64-bit embedded computing applications
Taipei, Taiwan, 27 April 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA AMOS-5001, a specially designed chassis kit for Em-ITX form factor...
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