Verschlagwortet: VIA Technologies

VIA Introduces VIA AMOS-5001 Chassis Kit for Slim Em-ITX Embedded Systems

Robust, flexible, and fanless, the VIA AMOS-5001 modular chassis kit provides the world’s slimmest and most compact chassis design for a broad spectrum of x86 64-bit embedded computing applications

Taipei, Taiwan, 27 April 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA AMOS-5001, a specially designed chassis kit for Em-ITX form factor...

VIA EPIA-P830 Pico-ITX: Multimedia Prowess Meets Networking Versatility in the Smallest of Places

Latest Pico-ITX board offers incredible HD multimedia over HDMI plus dual Mini-PCIe slots for enhanced connectivity options, delivering the smartest, most connected Pico-ITX board ever

Taipei, Taiwan, December 15, 2010 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-P830 Pico-ITX board for advanced portable and network connected embedded...

VIA Debuts World’s First USB 2.0 Audio Controller

Ideal for MIDI systems and USB soundcards, the new VIA Vinyl Envy VT1730 USB 2.0 Audio Controller brings studio-level performance to the home audio enthusiast

Taipei, Taiwan, 14 January 2010 – VIA Technologies, Inc., a leading provider of PC and prosumer audio silicon, today unveiled the VIA Vinyl Envy VT1730 USB 2.0 Audio Controller, the industry’s first...

Big on the Inside, Small on the Outside: VIA M’SERV S2100 Addresses SOHO and SMB Server Needs

VIA M’SERV S2100 is a compact, versatile server system suitable for a range of essential applications geared towards the needs of modern small business and home office users

Taipei, Taiwan, 12 January 2010 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA M’SERV S2100: a compact and versatile server system suitable for...

Most Powerful Pico-ITX Board Ever Packs the VIA Nano Processor, Powers VIA AMOS-3001, Industry’s Most Compact & Fanless IPC

VIA EPIA-P820 Pico-ITX board leverages the high performance 64-bit VIA Nano processor platform for next generation multimedia-intensive applications

Taipei, Taiwan, 5 January 2010 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-P820, the first Pico-ITX form factor board to feature the...

VIA Group Launches World’s First USB 3.0 Hub Controller

VIA Group Launches World’s First USB 3.0 Hub Controller

VIA VL810 SuperSpeed USB hub controller allows a single USB port to be used by up to four high-bandwidth USB 3.0 devices simultaneously

Taipei, Taiwan, 4 January 2010 – VIA Technologies, Inc., a leading innovator of power efficient x86 processor platforms, today unveiled the VIA VL810 SuperSpeed Hub Controller, the industry’s first integrated single chip...

VIA Nano Processor Readies VIA EPIA Boards for Next Generation Embedded Applications and Windows 7 Technologies

VIA EPIA-M800 and VIA EPIA-N800 boards feature VIA Nano processor for advanced multimedia performance in next generation embedded applications

Taipei, Taiwan, 15 December 2009 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest VIA EPIA-M800 Mini-ITX and VIA EPIA-N800 Nano-ITX boards. Featuring the...

VIA Brings Enhanced Windows 7 Desktop to Life with World’s Most Power Efficient DX10.1 Chipset

VIA Brings Enhanced Windows 7 Desktop to Life with World's Most Power Efficient DX10.1 Chipset VIA VN1000 boasts Blu-ray playback, DX10.1 graphics and DDR3 memory support

Taipei, Taiwan, December 10, 2009 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA VN1000 digital media chipset for next generation desktop and all-in-one...

VIA Mobile-ITX Brings Further Miniaturization and Greater Flexibility to Embedded Devices

Incredibly compact, 6cm x 6cm Mobile-ITX form factor is 50% smaller than Pico-ITX, enables next-generation embedded devices

Taipei, Taiwan, 1 December 2009 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced Mobile-ITX, the latest VIA-developed open form factor specification for the creation of...

Die neueste Mini-ITX HD Multimedia-Plattform vereint DX10.1 und zwei HDMI-Ports durch separate und integrierte Grafiken

Die VIA VB8003 ist die weltweit erste Mini-ITX Platine mit separaten und integrierten Grafiken, die mit Hilfe einer Vielzahl von Multi-Display Konfigurationen 1080p HD-Inhalte wiedergibt.

Taipei, Taiwan, 29. September 2009 – VIA Technologies, Inc, führender Entwickler leistungseffizienter x86 Plattformen, stellte heute die erste Mini-ITX Platine, die über einen integrierten Grafikprozessor und zwei HDMI-Ports verfügt, vor. Die VIA...

Ultimate Mini-ITX HD Multimedia Platform Combines DX10.1 and Dual HDMI through both Discrete and Integrated Graphics

The VIA VB8003 is the world's first Mini-ITX board to feature discrete on-board graphics, delivering 1080p HD content through a range of multi-display configurations

Taipei, Taiwan, September 22, 2009 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the first ever Mini-ITX board to feature a dedicated on-board graphics processor and...

VIA bringt stapelbares mehrstöckiges Chassis für VIA EPIA Platinen auf den Markt

VIA AMOS-1000 und VIA AMOS-2000 Chassis benutzen einzigartige stapelbare und modulare Designs für Mini-ITX und Nano-ITX-basierte industrielle SBCs

Taipei, Taiwan, 27 August 2009 – VIA Technologies, Inc, ein führender Innovator leistungseffizienter x86 Prozessorplattformen, kündigte heute seine neueste Ergänzung der Baureihe VIA AMOS universeller Chassisprodukte an; die VIA AMOS-1000 und VIA...