(Auszug aus der Pressemitteilung)
Sunnyvale, CA—November 8, 2006 – OCZ Technology Group, a worldwide leader in innovative ultra high performance and high reliability memory, today unveiled the new and improved OCZ NVIDIA® SLI™-Ready branded memory product family. The new PC2-7200 SLI-Ready and PC2-8500 SLI-Ready modules now feature the first ever exclusively designed heatspreader for NVIDIA.
OCZ worked closely together with NVIDIA to optimize these modules specifically for current and next generation NVIDIA based platforms. As part of the NVIDIA SLI technology ecosystem, these modules undergo a rigorous series of tests by NVIDIA and are certified to provide performance-minded enthusiasts and gamers the quality, compatibility, and stability they seek when building an SLI gaming system.
“OCZ and NVIDIA have been working closely together to deliver the ultimate experience to high-end consumers with the new SLI-Ready series of modules,” commented Dr. Michael Schuette, VP of Technology Development, OCZ Technology Group. “Through our cooperation, we are able to deliver a customized solution for NVIDIA gamers, enthusiasts, and SI’s, one that addresses both the EPP memory performance and cooling requirements with a solution that is tailor made specifically for these customers.”