(Auszug aus der Pressemitteilung)
Fremont, CA, September 14, 2007 – Corsair, a worldwide leader in high-performance computer and flash memory products, today announced they have been licensed by Intel to use the new Intel Extreme Memory Profile (XMP) certification logo. The certification will apply to the latest DDR3 modules offered by Corsair and specifically programmed with the new Intel XMP specification.
Through a significant partnership effort between system manufactures, motherboard suppliers and memory manufactures, the Intel Extreme Memory Profile specification is part of a complete eco-system architecture designed for the enthusiast PC user. The new XMP specification allows both the novice and the advanced user to easily configure their Intel P35, X38 and future systems for over-clocking performance. With both built in SPD optimized profiles as well as the ability to manually adjust timing parameters, systems can be fine tuned for intense gaming situations or for everyday home computing applications. The full line of Corsair Intel XMP DDR3 modules will be showcased at the Intel Developer Forum (IDF), Corsair Booth 343, September 18-20 in San Francisco at the Moscone Center West.
“Corsair and Intel have worked closely to evolve and develop next generation DDR3 SPD memory specifications. The Intel Extreme Memory Profile will open the door to a broader adoption of the DDR3 platform technology,” said Jack Peterson, VP of Marketing at Corsair. “As the recognized leader in high-performance enthusiast memory, we are proud to have worked with Intel to develop this optimized performance specification and to be the first licensee of the certification program logo,” continued Peterson.
Available immediately through Corsair’s worldwide authorized dealer channel, consumers can choose from the following XMP-enabled DDR3 product offerings:
Like other Corsair DDR2 products, DDR3 DOMINATOR and XMS3 DHX modules feature Corsair’s patent-pending DHX technology – an innovative quad-layer heat sink design that optimizes memory performance and reliability by maximizing thermal dissipation. With DHX Technology, heat is removed via two paths – the leads of the BGA chips into the PCB (convective cooling) and the back of the BGA packages into the custom designed extruded aluminum heat sinks (conductive cooling).