(Auszug aus der Pressemitteilung)
City of Industry, California, January 4, 2010 – GIGABYTE TECHNOLOGY Co., Ltd, a leading manufacturer of motherboards, graphics cards and other computing hardware solutions is pleased to announce that they will focus on new USB 3.0 SuperSpeed products at CES this year with compatible 3rd party device demos and the introduction of the GA-H57M-USB3 and GA-H55M-USB3 motherboards. These new motherboards are based on yet to be announced chipsets from Intel® and increase GIGABYTE’s range of SuperSpeed USB 3.0 motherboards to an unequalled 13 models. Cementing the company’s leadership in the onboard USB 3.0 motherboard market, GIGABYTE plans to introduce a further 11 motherboard models before the end of January 2010. An extensive list of available and ‘coming soon’ GIGABYTE USB 3.0 products is available here.
Demonstrating its commitment to developing the USB 3.0 ecosystem, GIGABYTE is working with other USB 3.0 device vendors to ensure cross-compatibility between products. With this in mind, GIGABYTE recently launched the USB 3.0 motherboard microsite that lists compatible 3rd party USB 3.0 devices that include an ultra slim USB 3.0 SSD from OCZ, external hard disk drive (HDD) enclosures from Inxtron and DoTop, an HDD docking station from Sharkoon and other USB 3.0 accessories from DoTop. More 3rd party USB devices are currently undergoing testing so watch this space for more exciting new SuperSpeed action.
GIGABYTE is also working with USB 3.0 integrated circuitry (IC) vendors on product compatibility such as Genesyslogic (USB 3.0 to SATA 3Gb/s Bridge Controller). Information about their CES presence and demos using GIGABYTE USB 3.0 motherboards is available from their website.
“We expect USB 3.0 to be a very hot topic at CES this year and it’s really exciting to see all the new applications and devices that have already been preannounced by the media and CES organizers,” commented Tony Liao, Associate VP for North American Sales and Marketing at GIGABYTE Technology Co. Ltd. “With our aggressive USB 3.0 motherboard roadmap and top-to-bottom range of solutions, we are ready to partner-up with every USB 3.0 device vendor in ensuring complete compatibility with GIGABYTE motherboards.”
GIGABYTE will demonstrate their market leading USB 3.0 motherboards and compatible 3rd party SuperSpeed devices at a party at the Palms Place Hotel and Spa, The Palms Las Vegas on January 6th starting at 7:45 PM. USB motherboards and 3rd party devices will also be on display at the GIGABYTE meeting rooms at the Venetian Hotel, Renaissance Suite from January 6th-9th. For an invitation to the party please contact firstname.lastname@example.org or to reserve a meeting time please contact email@example.com.
Featured Technologies on GIGABYTE USB 3.0 Motherboards:
USB 3.0 Support
GIGABYTE USB 3.0 motherboards support the latest generation SuperSpeed USB 3.0 technology made possible through an onboard NEC uPD720200 host controller. With superfast transfer rates of up to 5 Gbps, users are able to experience an almost 10x improvement over USB 2.0. Additionally, backwards compatibility with USB 2.0 assures users of long term use of their legacy USB 2.0 devices. The onboard NEC SuperSpeed USB 3.0 technology also provides new power management features that include increased maximum bus power and device current draw to better accommodate power-hungry devices.
3x USB Power Boost
The GIGABYTE GA-H55M-USB3 and GA-H57M-USB3 motherboards feature a 3x USB power boost, delivering greater compatibility and extra power for USB devices. GIGABYTE’s unique USB power design is also able to efficiently regulate output over the full voltage range, which greatly enhances USB device compatibility. In addition, dedicated lower resistance fuses ensure lower voltage drops, and provide more stable and plentiful power delivery.
* Available features vary by model. Please visit the GIGABYTE website to see a complete listing of motherboard model features.