Cooler Master and G.SKILL Partner to Bring Active Cooling Technology to DDR5 Memory

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Cooler Master, a global leader in innovative thermal solutions and PC hardware, today announced a partnership with G.SKILL to introduce new MasterDimm AC DDR5 memory featuring active cooling technology from Cooler Master. MasterDimm will be showcased during Computex 2026 at Cooler Master’s Taipei headquarters, where the company will present its broader thermal engineering vision across AI infrastructure, workstations, gaming systems, and next-generation PC platforms.

Sustained Stability for AI & Professional Workloads

Designed for next-generation AI computing, gaming, content creation, and professional applications, this new memory supports ultra-high capacities up to 64GBx2 while maintaining long-duration stability under intensive workloads. Cooler Master’s active thermal design helps ensure sustained memory performance, signal integrity, and reliable operation during continuous high-load usage.

Extreme Speed, Sustained by Dedicated Active Cooling

Featuring support for AMD EXPO™ memory overclock profiles up to DDR5-6000 CL26 and extreme-frequency DDR5 CU-DIMM up to DDR5-8400 with Intel XMP 3.0, the co-engineered solution combines G.SKILL’s elite overclocking memory technology with Cooler Master’s dedicated active thermal architecture to sustain peak DDR5 performance beyond conventional thermal limits.

Acoustic-Optimized High Performance

Extreme memory performance should not compromise overall system acoustics. The integrated cooling architecture is engineered to deliver efficient heat dissipation with a controlled noise profile, enabling high-frequency DDR5 operation while preserving a quieter and more refined PC experience.

The partnership reflects Cooler Master’s Computex 2026 theme, Thermal Authority, Every AI Reality, by addressing a clear mission in system design: to provide stability and sustainability under high workloads with low noise. Memory performance is becoming a more important part of overall system stability, and cooling must be considered from a full system perspective.

Key Product Features

• Next-Gen DDR5 Memory Platform: Super low latency up to 6000 MT/s CL26 (AMD EXPO™), extreme-frequency CU-DIMM up to 8400 MT/s (Intel XMP 3.0)
• Advanced Active Cooling Technology: MasterDimm AC active cooling provides up to –15°C thermal improvement
• Quiet Thermal Design: A noise-optimized blower fan and specially designed air flow heat sink allow for greater cooling under 35dB volume