Schlagwörter: VIA Technologies

VIA Announces Ultra Compact, Fanless VIA AMOS-3002 System

Delivers power efficient dual core processing in a ruggedized chassis system for a diversified range of embedded applications

Taipei, Taiwan, 17th May, 2012 – VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA AMOS-3002, an ultra compact, fanless system designed around the tiny VIA...

VIA Announces World’s First Quad Core Mini-ITX Boards

Most power efficient x86 quad core solution available on the market, targeted for immersive HD embedded environments

Taipei, Taiwan, 23rd February, 2012 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the world’s first quad core Mini-ITX boards featuring the latest VIA QuadCore...

VIA Announces Highest Performance Dual Core VIA EPIA-M910 Mini-ITX Board

The VIA EPIA-M910 is the ideal solution for a wide range of embedded applications featuring one of the richest I/O sets available for the embedded market

Taipei, Taiwan, 9th February, 2012 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the VIA EPIA-M910 Mini-ITX board, the latest dual core Mini-ITX board featuring...

VIA Launches First Ever Dual Core Pico-ITX Mainboard

The VIA EPIA-P900 packs in dual-processing capabilities into the industry’s smallest commercialized motherboard form factor

Taipei, Taiwan, November 9th, 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the industry’s first Pico-ITX board with dual core processing. Measuring just 10cm...

VIA Brings Fanless Dual Core Computing and USB 3.0 to Thin Embedded Devices

The new VIA EITX-3002 slim-line Em-ITX form factor board offers rich I/O and multimedia capabilities in a rugged VIA AMOS-5002 Industrial Chassis Kit

Taipei, Taiwan, 2 November 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the latest Em-ITX form factor board, the VIA EITX-3002, which combines rich...

VIA Sues Apple for Patent Infringement

VIA Sues Apple for Patent Infringement

Complaint covers three patents infringed by Apple products

Taipei, Taiwan, 22 September, 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced it has taken legal action against Apple Inc., filing a complaint with...

VIA Announces New Dual Core VIA VB8004 Mini-ITX Mainboard

VIA Nano X2 E-Series brings dual core computing to a scalable multi-display platform for advanced digital signage and gaming applications

Taipei, Taiwan, 20th July 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced a dual core version of the low power VIA VB8004 Mini-ITX board....

VIA Brings the True 32-bit/384KHz Studio Sound to the Home with the VIA Vinyl Envy VT1730 and VIA Vinyl Envy VT1731 Audio Controllers

Ideal for MIDI systems and USB audio devices Vinyl Envy VT1730 and VT1731 USB 2.0 Audio Controllers take home audio to the next level

Taipei, Taiwan, 16 May 2011 – VIA Technologies, Inc., a leading provider of PC and prosumer audio silicon, today announced VIA Audio’s first 32-bit/384KHz audio controllers, the VIA EnvyUSB VT1730 and VIA...

VIA Announces New VIA QuadCore Processor

World’s lowest power quad core x86 processor sets the new baseline standard for the next generation of mainstream PCs and notebooks

Taipei, Taiwan, 12 May, 2011 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the launch of the VIA QuadCore processor, the lowest power quad core...