VIA Announces Ultra Compact, Fanless VIA AMOS-3002 System
Delivers power efficient dual core processing in a ruggedized chassis system for a diversified range of embedded applications
Taipei, Taiwan, 17th May, 2012 – VIA Technologies, Inc, a leading innovator of power efficient computing platforms, today announced the VIA AMOS-3002, an ultra compact, fanless system designed around the tiny VIA...
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