VIA Mobile-ITX Brings Further Miniaturization and Greater Flexibility to Embedded Devices
Incredibly compact, 6cm x 6cm Mobile-ITX form factor is 50% smaller than Pico-ITX, enables next-generation embedded devices
Taipei, Taiwan, 1 December 2009 – VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced Mobile-ITX, the latest VIA-developed open form factor specification for the creation of...
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