(Auszug aus der Pressemitteilung)
Taipei, Taiwan, April 26 – Embedded System Expo (ESEC) Japan 2012 will hold during May 9th to May 11th in Tokyo, and KINGMAX will demonstrate its series of industrial grade of FLASH storage products—SSD(Solid Sate Drive), memory cards, DRAM and embedded memory–on the booth WEST11-65. Leveraging more than 20 years of DRAM and FLASH expertise in R&D and manufacturing, KINGMAX will present a complete series of industrial solution which is not only at latest specification but also has been undergone strict reliability test and verification to ensure the most stable quality.
KINGMAX Group is the world first memory module manufacturer owning IC packaging and testing facilities, and has long been committed to the innovation of the best memory module solutions. Leveraging years of R&D and manufacturing competency, KINGMAX first-launched Industrial products include three categories: Industrial Storage, Industrial Memory and Embedded Memory. First, KINGMAX will exhibit a series of industrial SSD, including SATA III and SATA II SSD—both withstand wide operation temperature（-40℃～85 ℃）. KINGMAX will also release mSATA SSD and Half-Slim SSD for Ultrabook and small form factor embedded systems.
For storage requirements in industrial PCs, POS, terminals and so on, KINGMAX will present industrial grade of SDXC memory card, which is compliant with SDA 3.0 specification and at capacity up to 64GB; and present the high speed industrial grade Compact Flash memory card. Aiming at the market for industrial automation and medical devices, KINGMAX especially release wide temperature DDR3 Long DIMM and SO DIMM at capacity of 2GB/4GB/8GB to provide wide variety to customers.
Another highlight for KINGMAX is Embedded Memory Solution: eMMC and eMCP. KINGMAX eMMC solution utilizes MCP(Multi-Chip Package) technology to integrate NAND FLASH and controller into one chip. It is compliant with JEDEC standard, and can be used for mobile device, smart TV, set-up box, car Infotainment, car Navigator…etc. eMCP(Embedded multi-chip package) is even more integrated solution, by packaging mobile RAM—LPDDR2 with eMMC into one chip. For industrial board makers or mobile device makers, highly integrated eMMC and eMCP reduce their effort in firmware design, decrease development cost and further speed up time to market. While KINGMAX group owns key technologies in packaging, such as MCP, die-stacking and wire-bonding, it is no doubt KINGMAX can successfully launch high quality Embedded Memory Solution.
KINGMAX series of industrial product undergo stringent reliability test to ensure its consistent quality while working under harsh industrial environment; examples of reliability tests include: high/ low temperature test, vibration and humidity test and more. Please come to visit KINGMAX booth at WEST11-65 for more information about advantages and solution of KINGMAX industrial products.