Leading Innovation at CES 2026: BIWIN’s Cutting-Edge Memory and Storage Solutions Across Industries

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BIWIN, a global leader in memory and storage solutions, announces its participation in CES 2026, January 6th-9th in Las Vegas, NV. At Galileo 1004, Level 1, Venetian Expo, BIWIN will showcase its latest innovations in ultra-compact, high-speed memory and storage solutions. This year, BIWIN will highlight its ongoing commitment to driving technological progress to meet the evolving needs of today’s demanding devices and applications, providing more powerful, more efficient, and more reliable solutions.

Known for its precision engineering and commitment to performance, BIWIN builds solutions to support the most demanding applications, from high-speed, space-efficient memory for embedded systems to robust, industrial-grade solutions widely used in harsh environments.

Featured Products at CES 2026 by BIWIN:

ePoP LPDDR4X: Ultra-Compact, High-Speed Memory Solution for Wearables

The BIWIN ePoP LPDDR4X integrates LPDDR4X DRAM and eMMC 5.1 into a single ultra-compact 8.00 x 9.50 mm PoP package, providing up to 290 MB/s read speed and 140 MB/s write speed with frequencies up to 4266 Mbps. This advanced storage solution offers up to 64 GB + 32 Gb capacity, perfect for space-constrained devices like smartwatches. Compared to previous generations, it delivers a 128.6% increase in frequency and a 32% reduction in size. The ePoP LPDDR4X also features low power consumption, advanced global wear leveling, and LDPC error correction for enhanced reliability and long-term performance in demanding environments.

LPDDR5X: High-Speed, Power-Efficient Memory for Flagship Devices

The BIWIN LPDDR5X delivers data rates up to 8533 Mbps and 68 GB/s bandwidth, offering rapid data processing for next-generation devices that require both speed and stability. With up to 16 GB capacity, the LPDDR5X handles complex, data-intensive tasks while maintaining a compact 12.4 x 8.2 mm form factor, for integration into space-constrained designs without compromising performance. Its power efficiency reduces consumption by 25% compared to previous memory generations, optimizing battery life in mobile and embedded devices for AI-driven platforms, 5G infrastructure, or advanced mobile devices.

Industrial and Automotive Storage Built for Tough Environments

TDQ203 Industrial SSD

• PCIe Gen4x4, NVMe 2.0
• Up to 7400 MB/s Read and 6700 MB/s Write
• Wide-Temperature Operation: -20°C to +70°C
• Capacity: 512 GB to 4 TB

TGS201 Industrial SSD

• 2.5” SATA SSD
• Up to 560 MB/s Read and 510 MB/s Write
• Wide-Temperature Operation: -40°C to +85°C
• Capacity: 128 GB to 2 TB Flexible Customization

TAE208 Automotive eMMC 5.1

• Reliability with AEC-Q100 Compliance
• Capacity: 64 GB – 128 GB
• Wide-Temperature Operation: -40°C to +105°C
• Durable in Harsh Conditions

TGC207 SD Card & TGC209 microSD Card

• Up to 158 MB/s Read and 123 MB/s Write
• Speed Class: C10, U3, V30
• Wide-Temperature Operation: -40°C to +85°C
• Capacity: 32 GB to 256 GB

Powering High-End Builds: Tailored Storage Solutions for PC OEMs

APX03 SSD

The BIWIN APX03 SSD is a high-performance storage solution that delivers read and write speeds up to 10000 MB/s through PCIe Gen5x4 and NVMe 2.0. Powered by 6nm process technology and 3D TLC NAND flash, the APX03 provides exceptional reliability and speed, ideal for premium laptops, gaming systems, and professional applications. Advanced thermal management keeps the SSD cool even under heavy loads, while optimized power efficiency extends battery life in mobile devices.

EP410 PCIe BGA SSD

The BIWIN EP410 PCIe Gen4x4 BGA SSD is engineered for embedded systems and space-constrained mobile devices, delivering exceptional performance in a compact 16.00 x 20.00 x 1.40 mm form factor. Leveraging the PCIe Gen4x4 interface and NVMe 2.0, the EP410 achieves read speeds of up to 7300 MB/s and write speeds of up to 6300 MB/s. It offers faster data access and improved system responsiveness for high-demand applications like autonomous driving, drones, and ultrabooks. Designed with an intelligent power management system, the EP410 dynamically adjusts power consumption to reduce energy use during both operational and idle states.

Visit BIWIN at CES 2026

Discover the latest in memory and storage technology with BIWIN at CES 2026. Join us at Galileo 1004, Level 1, Venetian Expo, from January 6th-9th in Las Vegas. Explore how BIWIN’s memory and storage solutions can drive innovation in your projects and provide reliable, efficient solutions for a wide range of applications.