Samsung Develops Advanced Packaging Technology to Achieve a 0.6mm-thick 8-chip Package

(Auszug aus der Pressemitteilung)

Seoul, Korea, November 4, 2009 – Samsung Electronics Co., Ltd., the world

leader in advanced semiconductor technology solutions, announced today that
it has developed the world’s thinnest multi-die package, one that measures
a mere 0.6mm in height. Designed initially for 32 gigabyte (GB) densities,
the new memory package is just half the thickness of a conventional memory
package of eight stacked chips (or dies). The advanced packaging technology
delivers a 40 percent thinner and lighter memory solution for high-density
multimedia handsets and mobile devices.

„Thin remains the action word in today’s mobile environment and we’re
taking a big step here at Samsung to make higher density memory less than
half the thickness of what it was before,“ said Richard Walsh, associate
director, memory marketing, Samsung Semiconductor, Inc.

The new ultra thin package features a significantly thinner „bare“ die that
measures only half the thickness of a conventional die. The new 0.6mm-thick
package, which consists of eight identical dies (called an octa-die
package), uses 30-nanometer class, 32 gigabit (Gb) NAND flash chips, each
measuring just 15um*, to deliver a 32 gigabyte (GB) NAND solution.

The newly developed ultra-thinning technology overcomes the conventional
technology limits of a chip’s resistance to external pressure when under
30um in height. The productivity decline resulting from this thickness
limitation had been directly attributable to a drop in production yields
during mass production.

The 15um-thickness represents a significant achievement as it can allow for
double the density of previous multi-chip packages. The thinner die also
dramatically reduces chip weight.

In addition, the new package technology can be adapted to other existing
MCPs, configured as system in packages (SiPs), or package on packages
(PoPs). The breakthrough technique for 15um-and-under chip thicknesses will
allow for the design of very high density solutions with the smallest of
form factors – an extremely attractive prospect for the highly competitive
mobile market.

„We have achieved a major reduction in the thickness and weight of a large
multi-die package to provide the best solution for combining higher density
with multi-functionality in current mobile designs,“ said Tae-Gyeong Chung,
vice president, test and package center, package development team, Samsung
Electronics. „A package height under 1mm will provide set designers with
much greater freedom in creating attractive designs that satisfy the
diverse styles and thin-focused tastes of consumers today.“

According to market research firm, iSuppli, for memory cards of 2GB
densities and higher, 310 million units are expected to be produced in 2009
(60 percent of total production), a number projected to grow to 7.7 billion
units by 2012 (89 percent of total production).

Moreover, iSuppli estimates the portion of memory cards 16GB and higher to
be 35 million units (16GB equivalents) this year, a number expected to
reach 530 million units by 2012 – representing a, a 15-fold growth spurt.
This portion of the overall card production would jump from 33 percent to
74 percent during the same period.

* Note: 15um wafer is 1/7 the thickness of A4 paper (~100um).