AMD Adds New Levels of Processing Performance to Embedded BGA Client Platform
Dual-core processors with leading-edge chipsets, graphics capability and BGA packaging offer all-in-one platform
SUNNYVALE, Calif. — August 10, 2009 – AMD (NYSE: AMD) today announced immediate availability of two new dual-core, 18W TDP processors for the highly-scalable ASB1 BGA embedded client platform. The AMD Turion™...
Neueste Kommentare
18. Dezember 2025
11. Dezember 2025
11. Dezember 2025
5. Dezember 2025
4. Dezember 2025
2. Dezember 2025