OCZ Technology Unveils the XTC (Xtreme Thermal Convection) Memory Cooler

(Auszug aus der Pressemitteilung)

Sunnyvale, CA—November 16, 2006 – OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled the premier memory overclocking accessory, the OCZ XTC Cooler. As active cooling becomes increasingly important for today’s high-speed memory solutions, OCZ developed the XTC Cooler for effective heat management of OCZ’s proprietary XTC (Xtreme Thermal Convection) modules.


Once installed over the memory subsystem, the XTC Cooler’s dual 60mm fans channel a steady flow of air over and through the XTC modules creating a cooler environment for the memory ICs. For the overclocking enthusiast accustomed to awkwardly propping up case fans, the aluminum-based XTC Cooler is the ultimate air cooling solution.

“To address the requirements of extreme overclockers OCZ is releasing the new XTC cooler which is designed to pair up with the Xtreme Thermal Convection heatspreaders utilized on our entire lineup of premium memory solutions,” commented Alex Mei, OCZ Technology Group, Inc. “This cooler forces airflow through our open Xtreme Thermal Convection heatspreader design to offload even more heat from the entire module array, thus enhancing both stability and performance of the memory, especially when aggressively overclocking.”