(Auszug aus der Pressemitteilung)
Taipei-Taiwan – February 8th 2012 – G.Skill, the worldwide leading high performance memory designer and manufacturer, has announced the brand new Ares series low profile performance DDR3 memory.
Stylish Low Profile Heat Spreader
Featured with low profile heat spreader design (3.2cm in height), G.Skill Ares series DDR3 memory modules are the perfect choices for building high performance PCs with large CPU coolers, small form factor desktop computers or any other systems with more restricted space.
The Best Compatibility and Reliability
Every Ares memory kit is hand-tested with G.Skill rigorous internal validation process to ensure the maximum stability and compatibility with both Intel and AMD platforms.
Compliant with the latest Intel XMP (Extreme Memory Profile) function, G.Skill Ares series DDR3 memory provides PC enthusiasts and extreme gamers a trouble free overclocking experience on Intel platforms, while enjoying the enhanced memory bandwidth.
G.Skill Ares specifications are listed as below. Specifications are subject to change without notice.