Thermaltake Introduces the CAPO X Dual-System Chassis Built for Advanced AI Workflows

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Thermaltake, a leading PC DIY brand for premium hardware solutions, unveils the CAPO X at COMPUTEX 2026, a dual-system chassis built for users who demand greater flexibility, multitasking, and performance in a single setup. Short for Cross-platform Architecture for Parallel Operation, CAPO X supports two fully independent Micro-ATX systems inside one enclosure, creating a streamlined platform for AI computing, streaming, gaming, and professional workflows.

Dual-System Performance in One Chassis

CAPO X enables two systems to run simultaneously within a single chassis, allowing users to separate workloads for improved efficiency and stability. Whether handling gaming and streaming independently or running background AI tasks alongside daily work, CAPO X delivers a cleaner and more space-efficient alternative to traditional dual-PC setups.

Built for AI, Streaming, and Professional Workflows

As localized AI PCs continue to evolve, CAPO X offers a highly flexible platform for dedicated AI processing and secure multitasking. Its physically separated dual-system design allows the secondary system to run a dedicated AI agent that seamlessly collaborates with the user in real-time without interrupting primary tasks, isolating AI workloads or different operating systems while maintaining smooth performance across both systems.

For streamers and creators, CAPO X supports a complete dual-PC streaming setup in one chassis, allowing one system to focus on gameplay while the second handles encoding, broadcasting, and recording.

CAPO X also introduces a practical solution for shared setups. Couples, roommates, or friends can maintain two fully independent systems while sharing a single desk space, offering a cleaner and more space-efficient alternative to traditional dual-tower configurations.

Space-Efficient Design with Extensive Cooling

Designed with a vertical stacked layout, CAPO X saves desk space while showcasing both systems through panoramic curved tempered glass panels. The chassis supports hidden-connector motherboards, up to thirteen 120 mm fans, and dual 360 mm radiators mounted simultaneously for optimized airflow and cooling performance.

As the load-bearing structure is constructed with 1mm thick steel plates, CAPO X is engineered to support the thermal and structural demands of two high-performance systems while maintaining a clean and modern presentation.

Features of the CAPO X:

• Dual-System Micro-ATX Design – Supports two independent systems within one chassis.
• Optimized for AI and Multitasking – Separate workloads for AI computing, streaming, gaming, and productivity.
• Cross-Platform Flexibility – Supports multiple operating systems and professional workflows.
• Space-Saving Vertical Layout – Compact design compared to traditional dual-tower setups.
• Extensive Cooling Support – Supports up to thirteen 120 mm fans and dual 360 mm radiators.
• Hidden-Connector Motherboard Compatible – Enables cleaner cable management and streamlined builds.
• Durable 1 mm SPCC Steel Construction for load bearing structure– Built for dual high-performance system configurations.