Samsung’s New Single Wire Protocol Compliant SIM Card IC Offers Increased Data Security and Reliability

(Auszug aus der Pressemitteilung)

BARCELONA, Spain, February 11, 2008 – Samsung Electronics Co., Ltd., a leader in advanced semiconductor technology, announced today a new high-density 768kilobyte (KB) flash embedded SIM card IC, the S3FS91J. Fully compliant with the recent European Telecommunications Standards Institute (ETSI) standard of single wire protocol (SWP), Samsung’s new S3FS91J IC offers consumers increased personal data security and user authentication reliability with the most advanced security technology. SWP specifies a standard interface for interconnection between the SIM card chips and the near field communication (NFC) chips.

Samsung’s suite of advanced products for portable consumer applications will be on display at the Mobile World Congress 2008 in Hall 1, Booth #D33 of the Fira de Barcelona, Montjuic.

“For consumers, the ability to pay for services wirelessly is becoming more attractive as communication technology matures and security concerns have been minimized,“ said Yiwan Wong, vice president, Marketing Team, System LSI Division, Semiconductor Business, Samsung Electronics. “Samsung’s new S3FS91J SWP SIM card IC, which is based on a high performance 32-bit CPU, a 20KB RAM for data processing, and a 32KB ROM for the boot loader program, introduces to consumers the very exciting experience of secure payments and services using their mobile phones.”

With on-chip support for symmetrical encryption/decryption standards (DES/ triple DES) and asymmetrical encryption standard (RSA), the S3FS91J also lends itself well to applications such as mobile TV and mobile ID where secured user authentication and data transactions are critical.

The S3FS91J’s user storage is based on embedded flash technology that allows easy wireless software upgrades and data downloads through over-the-air (OTA) technology, thus allowing mobile handset users more convenient access to a wide variety of additional services.

Samsung’s platform-based SWP SIM card chips also come with two new lower-density versions; the 420KB- (S3FS91V) and the 512KB- (S3FS91H) embedded flash memory SIM card ICs.

Market research firm ABI Research expects NFC-enabled mobile handsets with mobile payment features to reach over 300 million units, approximately 20 percent of the total mobile handset market, in 2010.

Samsung’s new SWP SIM card chips are expected to be sample available in April, with mass production scheduled for the third quarter of 2008.